发明名称 DICING DIE-BONDING FILM
摘要 A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10-40 mol % to 100 mol % of the acrylic ester, an isocyanate compound having a radical reactive carbon-carbon double bond where a ratio is in a range of 70-90 mol % to 100 mol % of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds where a ratio is in a range of 10-60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer.
申请公布号 US2010029061(A1) 申请公布日期 2010.02.04
申请号 US20090533356 申请日期 2009.07.31
申请人 KAMIYA KATSUHIKO;MATSUMURA TAKESHI;MURATA SHUUHEI;OOTAKE HIRONAO 发明人 KAMIYA KATSUHIKO;MATSUMURA TAKESHI;MURATA SHUUHEI;OOTAKE HIRONAO
分类号 H01L21/78;B32B27/30;B32B27/38;B32B37/12;B32B38/00 主分类号 H01L21/78
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