| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface roughness detecting method for a substrate, with which even fine unevenness smaller than the detection limit of an existent measuring instrument is accurately detected, the surface roughness detecting method for the substrate being suitable for mass-production of the substrate and also high in versatility. Ž<P>SOLUTION: The surface roughness detecting method of detecting surface roughness consisting of fine projection portions and recessed portions on the surface of a wafer W comprises: freezing condensed moisture content 52 to generate crystal 53 of ice after cooling the wafer W to condense moisture content 51 in vapor phase on the surface of the wafer W; and growing the crystal of ice along a projection portion slope or recessed portion slope of surface unevenness C of the wafer W in three dimensions to emphasize the unevenness on the surface. Then, the surface unevenness C of the wafer W emphasized by the crystal 53 of ice is measured by the existent measuring instrument. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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