| 摘要 |
A method of manufacturing an apparatus 200 comprising forming an integrated magnetometer package 202. Forming an integrated magnetometer package 202 includes forming a movable part 215 from a MEM magnetometer substrate 210, and attaching an integrated circuit 910 to one side 212 of the MEM magnetometer substrate. A spacer structure 410 is formed on an opposite side of the MEM magnetometer substrate such that the moveable part is exposed through an opening 420 in the spacer structure. But the moveable part cannot escape through said opening. A permanent magnet 1010 is mounted through the opening to the movable part.
|
