| 摘要 |
The invention provides a novel compound of materials, which solves the problem of metal diffusion into glass layers during the formation of electrodes on a glass substrate. The invention provides a compound which comprises a powder of a conducting metal or alloy and a powder of a meltable metal or alloy. The use of a metal compound furthermore makes it possible to eliminate a firing step in the electrode formation process. Depending on various embodiments, the compound may furthermore include an adhesion promoter, in order to bond the electrodes to the substrate, a resin and/or a photosensitive substance. The invention also relates to a process for manufacturing a plasma panel using the said compound, and to a plasma panel obtained by the said process. |
