| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting substrate set that easily prevents a plurality of circuit elements from peeling from a mounting substrate, the mounting substrate suitable to the mounting substrate set, and a method of manufacturing the mounting substrate set. Ž<P>SOLUTION: An FPC substrate 21 on which a circuit element 31 is mounted is fitted with a reinforcing sheet 11, which is shaped to enclose the periphery of a group 25GR of parts scheduled to be mounted as a set of a plurality of parts 25 scheduled to be mounted. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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