| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of determining the quality of a chip nearby an outer circumference of a wafer which has a risk of a decrease in quality on the basis of a result of a wafer test of the wafer having a plurality of chips arranged in a matrix form along directions in an X axis and in a Y axis. Ž<P>SOLUTION: On the basis of the result of the wafer test (S1), defective chips are classified into defective groups such that adjacent defective chips belong to the same group (S2). When the number of defective chips belonging to a defective group is larger than a preset defective chip number threshold, it is determined that the defective group forms a concentrated defect distribution (S3). A concentrated defect distribution which influences a chip nearby the outer circumference of the wafer is selected (S4). The chip nearby the outer circumference of the wafer that the concentrated defect distribution influences is set as a determination target chip nearby the outer circumference of the wafer (S5). A quality determination index for the determination target chip nearby the outer circumference of the wafer is calculated (S6). The quality determination index and a quality determination index threshold are compared with each other to determine the quality of the determination target chip nearby the outer circumference of the wafer. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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