发明名称 MOTHERBOARD MODULE ARRAY
摘要 A motherboard module array suitable for being assembled to a chassis of a server is provided. The chassis includes a bottom plate, two sidewalls, a front plate, and a rear plate opposite to the front plate. The motherboard module array includes at least one group of dividing plates and a plurality of motherboard modules. The dividing plates are arranged inside the chassis and in parallel to the two sidewalls and have at least one group of supporting rails extending inwards. Each of the motherboard modules includes a motherboard which has a plurality of components and an extractable tray which supports the motherboard, wherein the extractable tray is disposed on the supporting rails and the extractable tray is suitable for being pulled out from the chassis.
申请公布号 US2010027214(A1) 申请公布日期 2010.02.04
申请号 US20080331712 申请日期 2008.12.10
申请人 INVENTEC CORPORATION 发明人 WU JIAN-FENG;YANG SHOU-JEN
分类号 H05K5/00;H05K7/20 主分类号 H05K5/00
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