| 摘要 |
PROBLEM TO BE SOLVED: To provide a production process of a semiconductor device that can prevent deterioration of joint reliability even if a relatively low-cost package carrier with low softening temperature is used, can use a common bump material, and can control an increase of a production cost. SOLUTION: When a terminal 12 of a semiconductor chip 10 and a terminal 22 of a package carrier 20 are joined, a temperature at which the package carrier's base material 21 becomes soft is applied to the semiconductor chip 10, the terminal 12 of the heated semiconductor chip 10 is brought into contact with the package carrier's terminal 22, the package carrier's terminal 22 and the package carrier's base material 21 around it are softened through the conductive heat transfer, the semiconductor chip terminal 12 is pressed and joined to the package carrier's terminal 22 while the package carrier's terminal and the package carrier's base material 21 around it are softened, and the package carrier's terminal 22 is set in such a state as is pushed inner than the surface level of the package carrier's base material 21. COPYRIGHT: (C)2010,JPO&INPIT
|
