| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder joint structure which sucks molten solder up to a predetermined height. SOLUTION: A good heat collection portion provided at the distal end 23a of the leg terminal 23 of a connection member (bus bar 20A) which is jointed to a substrate by flow soldering collects heat of molten solder in a solder tank well. A heat conduction limiting section (through-holes 23b) provided at positions between the good heat collection portion and the component mounting portion (a large capacity portion) 21 at such a height as the solder is sucked up limits heat conduction from the good heat collection portion to the component mounting portion 21. COPYRIGHT: (C)2010,JPO&INPIT |
