| 摘要 |
PROBLEM TO BE SOLVED: To provide an bonding film suppressing bending of a bonded semiconductor chip in the case where the chip is thin and has a large plane area. SOLUTION: The adhesive film 3 is used for bonding a semiconductor chip 4 having a thickness of 50 μm or smaller and a plane area of 50 mm<SP>2</SP>or larger to a substrate 2, wherein the bonding film contains an epoxy resin of a 100 weight part, a curing agent of a 20 to 70 weight part, and a fumed silica particle of a 5 to 30 weight part, and the lowest melt viscosity in the temperature range of 70 to 120°C is in the range of 2,500 to 10,000 Pa s. COPYRIGHT: (C)2010,JPO&INPIT
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