发明名称 PLASMA TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which allow abnormalities in the exhaust capability of a vacuum pump and in a vacuum piping system to be easily monitored online for appropriately monitoring the operating state of the apparatus. Ž<P>SOLUTION: A plasma treatment apparatus 1 that performs plasma treatment on a substrate 8 in a treatment chamber 3a is provided with a second vacuum sensor 17, which is provided between a vacuum pump 14 and a vacuum valve 13 that connects/disconnects the treatment chamber 3a to/from the vacuum pump 14 in an exhaust piping system 12, in addition to a first vacuum sensor 15 which measures an attainable vacuum in the treatment chamber 3a. On the basis of a measuring result obtained by the second vacuum sensor 17 with the vacuum valve 13 closed, abnormalities in the exhaust capability of the vacuum pump 14 and abnormalities in a vacuum exhaust pipe 12b, such as a vacuum leak, are detected by a control section 22. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010027836(A) 申请公布日期 2010.02.04
申请号 JP20080186920 申请日期 2008.07.18
申请人 PANASONIC CORP 发明人 MIYAGAWA TAKASHI
分类号 H01L21/3065;H01L21/304;H01L21/31 主分类号 H01L21/3065
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