| 摘要 |
The manufacturing method involves preparing an antenna (2) by mounting an antenna structure on a substrate (3) using an additional process. The antenna structure is mounted by metal deposition, where the substrate is made of a PVC or polycarbonate material. A surface (4) of the substrate, apart from the mounted antenna structure, is exposed. A transponder (6) is fabricated by a flip-chip process, where a Radio-frequency identification (RFID)chip (5) is connected with the antenna. An independent claim is included for a manufacturing device for a wireless communication device, particularly contactless map, e-passport, smart label or prelaminate. |
