发明名称 TRANSFOERMATIONAL PREVENTION METHOD OF PROVISIONAL PROCESSION AT MANUFACTURING PROCESS OF FLEXIBLE PCB BOARD
摘要 PURPOSE: A method for preventing deformation of a coverlay lamination process is provided to prevent a defect due to dust in a hot-press forming process using a Teflon film. CONSTITUTION: A Teflon film(32) is laminated on an upper surface and a lower surface of a flexible substrate(31). The flexible substrate is formed with the hot-press. The Teflon film is removed from the flexible substrate. The weight of the Teflon film is 160g/m^2. The thickness of the Teflon film is 0.08 mm. The Teflon film is used between -100 and 260 degrees centigrade.
申请公布号 KR20100011476(A) 申请公布日期 2010.02.03
申请号 KR20080072712 申请日期 2008.07.25
申请人 GU, MI SUK 发明人 GU, MI SUK
分类号 H05K3/22 主分类号 H05K3/22
代理机构 代理人
主权项
地址
您可能感兴趣的专利