| 摘要 |
PURPOSE: An electronic chip module is provided to improve the heat generation between a radiation element and a heat sink by using a metal wire. CONSTITUTION: An electronics chip module comprises a radiation element chip(110), a circuit board(100) for a module, and a junction dielectric layer(140). The radiation element chip is arranged on the circuit board for the module. The circuit board for module has at least one radiation via on a first and second side. In this case, the first and 2 side are faced with each other on the circuit board for the module the radiation element chip is arranged on the first side of the circuit board for the module. At least one radiation via is arranged between the first and second side of the printed circuit board for the module. A junction resin layer is adhered on the second side of the circuit board for the module. A heat sink is arranged on the junction resin layer. |
