| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board and electronic equipment that efficiently cool electronic components on a substrate. SOLUTION: The circuit board includes the substrate 12 where outside air 30 flows over principal surfaces 12b and 12c, first electronic components 15 and 16 mounted on one principal surface of the substrate 12, a through-hole 12a formed in the substrate 12 disposed downstream from the first electronic components 15 and 16 in the flowing direction of the outside air 30, a second electronic component 14 mounted on the principal surfaces 12b and 12c of the substrate 12 and downstream from the through-hole 12a in the flowing direction of the outside air 30, and a control unit 20 capable of varying the flow rate of the outside air 30 passing through the through-hole 12a. COPYRIGHT: (C)2010,JPO&INPIT
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