| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg, a laminated plate, a multilayer printed wiring board and a semiconductor device, reducing elevation of thermal expansion coefficient in the plane direction within the temperature range of ordinary to mounted region and reducing the warpage of a mounted multilayered printed wiring board. SOLUTION: The prepreg is produced by impregnating a resin composition consisting essentially of (A) a specific multifunctional epoxy resin having a naphthalene ring, (B) a phenol novolac type cyanate resin, (C) a curing agent and (D) an inorganic filler, into a base material. The curing agent is preferably an imidazole compound. COPYRIGHT: (C)2010,JPO&INPIT |
