CHIP PACKAGE AND STACKED PACKAGE USING THE SAME AND METHOD OF FABRICATING THEM

摘要

PURPOSE: A chip package and a stacked package thereof and a manufacturing method thereof are provided to increase a feature density by burying a semiconductor chip in the cavity area of substrate with a flip chip type. CONSTITUTION: A substrate(10A) comprises a substrate body layer(10c). The substrate body layer includes a first main surface(10a) including a cavity area and a second major surface(10b) including an wiring patterns for a external connection. One or more semiconductor chip(50) is loaded in the cavity area. Connection pads in the semiconductor chip is bonded with a flip chip type to a part among wiring patterns exposed through a hole formed in the bottom side of the cavity area.