| 摘要 |
PURPOSE: A wafer plating device is provided to reduce the maintenance cost and reduce the replacement time of the metal plate. CONSTITUTION: A wafer plating device comprises a process chamber(10), a substrate(20) and a metal plate(30). The process chamber has a space to store electrolyte(S). A rotatable plating chamber(12) is installed inside the process chamber with a shaft(11). First and second filters(13,14) are formed inside the plating chamber in order to filter the metallic ion of electrolyte. A negative electrode unit(22) moves to the substrate which is located between a substrate and a chuck. An expansion unit(32) is formed on the contact surface in order to expand the contact surface with electrolyte. The expansion unit is formed on a metal plate and is composed of a plurality of grooves(33).
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