发明名称 |
DEFECTIVE DISCRIMINATING METHOD FOR LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD FOR LAMINATED ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a defective discriminating method for a laminated electronic component that predicts the production of a defective of the laminated electronic component and lowers the manufacturing cost of the laminated electronic component in total, and a manufacturing method for the laminated electronic component. Ž<P>SOLUTION: The defective discriminating method for the laminated electronic component includes the steps of: forming marks M1 on a surface of a green sheet for an external layer at positions corresponding to individual chips before stamping a green laminate 4a; stamping the green laminate 4a having the marks M1 formed; reading positions of the marks M1 formed on the surface of the green laminate 4a having been stamped by an image processing apparatus and calculating an amount of a shift between positions of the marks M1 before and after the stamping; and discriminating whether an advance to next steps including a cutting step is made on the basis of data obtained by comparing the amount of the position shift with a threshold. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010027779(A) |
申请公布日期 |
2010.02.04 |
申请号 |
JP20080186013 |
申请日期 |
2008.07.17 |
申请人 |
TDK CORP |
发明人 |
MORI MASAHIRO;SHIRAISHI KEISUKE;FUKADA YUSUKE |
分类号 |
H01G13/00;H01G4/12;H01G4/30 |
主分类号 |
H01G13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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