发明名称 Dicing die-bonding film
摘要 The present invention is a dicing die-bonding film having a dicing film having a pressure-sensitive adhesive layer (2) on an ultraviolet-ray transmitting base (1) and a die-bonding film (3) provided on the pressure-sensitive adhesive layer (2), wherein the pressure-sensitive adhesive layer (2) is formed by laminating the die-bonding film (3) onto a pressure-sensitive adhesive layer precursor formed from an acrylic polymer comprising an acrylic ester as a main monomer, a hydroxyl group-containing monomer at a ratio in the range of 10 to 40 mol% with respect to 100 mol% of the acrylic ester, and an isocyanate compound having a radical reactive carbon-carbon double bond within a molecular at a ratio in the range of 70 to 90 mol% with respect to 100 mol% of the hydroxyl group-containing monomer, and then curing by irradiating with an ultraviolet ray from the base side, and the die-bonding film is formed from an epoxy resin.
申请公布号 EP2149900(A2) 申请公布日期 2010.02.03
申请号 EP20090166860 申请日期 2009.07.30
申请人 NITTO DENKO CORPORATION 发明人 MATSUMURA, TAKESHI;KAMIYA, KATSUHIKO;MURATA, SHUUHEI;SUGO, YUKI
分类号 H01L21/58;C09J7/02;H01L21/68 主分类号 H01L21/58
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