| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus capable of mounting an electronic component without significantly thermally affecting a carrier tape. Ž<P>SOLUTION: When mounting an electronic component 16 on a carrier tape 1 by the mounting apparatus, a mounting tool 18 heated by a second heater 36 is moved down to the height at which a lower end face of the mounting tool is brought close to the upper surface of the carrier tape 1 and waited, a mounting stage 17 heated up to a temperature higher than that of the mounting tool by a first heater 35 is moved up to a mounting position, and then the mounting tool is further moved down, and mounting load is controlled by a controller 25 based on load detected by a load cell 37 to mount the electronic component on the carrier tape 1. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
