发明名称 LED MODULE
摘要 PURPOSE: An LED module is provided to the efficiency of heat dissipation by allowing the top side of heat sink separated from the LED chip and discharging the heat to the outside. CONSTITUTION: A transparent lens is installed on electrode wires(802,803) formed with a bonding wire(801). An LED chip(201) is exposed to the outside and emits the light when receiving power. A Keronite aluminum heat sink is formed as a wing and ring bar in the lower part of the LED chip. The Keronite aluminum heat sink is coated with insulating porous Keronite. A electrode wire is inserted to the ring bar. A reflector(301) is hollow hemi spherical shape from the outside of an upper part of the ring bar to the upper part of wing.
申请公布号 KR20100011070(A) 申请公布日期 2010.02.03
申请号 KR20080072125 申请日期 2008.07.24
申请人 OPTRONTEC CO., LTD. 发明人 PARK, BYUNG SUN;LEE, YONG TAE;CHOI, YOUNG JUN
分类号 H01L33/64;H01L33/60 主分类号 H01L33/64
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