| 摘要 |
<p>The invention relates to a cooling arrangement having a semiconductor component (1), which comprises a top and a bottom, wherein a bearing surface (9) that gives off heat is arranged on the bottom, said bearing surface being thermally connected to a cooling body (2), and wherein the semiconductor component (1) comprises at least one fastening hole (10), the axis of which is arranged substantially orthogonal to the bearing surface (9) of the semiconductor component (1). To this end, a bushing (3), made of electrically insulating material, is provided, which is guided through the fastening hole (10) and rests on the fastening hole edge with a collar on the top of the semiconductor component (1), wherein the bushing (3) projects over the bottom of the semiconductor component (1), and furthermore wherein the cooling body (2) is exposed over said projecting part of the bushing (3) and wherein a fastening element (4) is provided, which is connected to the bushing (3) and supported on the cooling body (2) such that the bushing (3) is tensioned against the cooling body (2).</p> |
