INTERPOSING SHEET FOR SEMICONDUCTOR LEAD FRAME METAL AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor lead frame interposing sheet and a method thereof are provided to remarkably improve durability by conducting an operation for protecting static electricity in case of a surface damage due to friction. CONSTITUTION: A body part(10) is composed of a plastic material. A surface part(20) is composed in the surface of the body part. The surface part is composed of the plastic material including an antistatic agent(24). The body part forms the base of a lead frame interposing sheet for a metal. The surface part formed on the surface of the body par is directly contact with the lead frame metal. The antistatic agent prevents a static electricity due to the electrification by electric charge by improving the resistance characteristic of the surface part. The antistatic agent is mixed with a synthetic resin like a polyethylene, a polypropylene and polystyrene. A concavo-convex(26) is additionally formed in the surface part.