METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD USING SELECTIVE PLATING BY FORMING MIDDLE-LAYER

摘要

PURPOSE: A method of manufacturing a multi-layer circuit board using selective plating by forming a middle-layer is provided to manufacture a multiple layers through a simple process by selectively forming and plating an interlayer. CONSTITUTION: A metal layer is formed on the surface of a material layer, and a first protective covering pattern is formed on the surface of the metal layer. The material layer is selectively processed by anode oxidation and a first protective covering pattern is removed. An interlayer is formed on the surface from which the first protective covering was removed. The second protective covering pattern is formed on the surface of the intermediate layer. The intermediate layer is selectively etched by the second protective covering pattern.