| 摘要 |
PURPOSE: A test device for a multi stacked package is provided to reduce inspection costs and test time by securing normal operation while being combined with an upper package at the same time. CONSTITUTION: A second circuit test board(220) mounts a device(2) and is electrically connected to the device. An upper socket assembly(200) is combined in the second circuit test board. A lower part socket assembly(100) is mounted in the first circuit test board(110). The top side of lower device mounted on the lower socket assembly is contacted to the upper socket assembly. An inspection current applied from the outside passes through the lower device and is applied to the upper device. The upper socket has a first coupling hole perpendicularly and is combined in the top side of the first circuit test board.
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