| 摘要 |
PURPOSE: A camera module and a method for manufacturing the same are provided to minimize time for a focusing process and a bonding process and a particle inflow in the process. CONSTITUTION: A holder includes a plurality of lenses and an infrared filter. A PCB(Printed Circuit Board)(14) is inserted to the lower inside of the holder for bonding in the lower inside of an integrated assembly(20) after a height control for a focusing deviation correction. An image sensor(15) is put on the PCB and changes a optical signal passing through the infrared filter into an image signal. The lens is located in a focused point of the holder. A lower part of the holder is projected in a build up structure(21) and the PCB is located in order to be wrapped with the build up.
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