发明名称 APPARATUS FOR PROVIDING EPOXY MOLDING COMPOUNDS
摘要 PURPOSE: An apparatus for providing epoxy molding compounds is provided to simplify the structure of the apparatus by vibrating a guide unit for epoxy molding compound blocks by using a connection bar connected eccentrically to a motor. CONSTITUTION: An epoxy supply part(110) supplies epoxy molding compound blocks through a drop method. A guide unit(120) guides blocks which are under the epoxy supply part and drop the blocks to one side. A vibration part(130) shakes the guide unit so that the blocks are smoothly transferred. The vibration part comprises a motor which generates torque and a rotating member(134) that is connected to the motor and is rotated. A connection bar(136) interconnects the rotating member and the guide unit.
申请公布号 KR20100011380(A) 申请公布日期 2010.02.03
申请号 KR20080072573 申请日期 2008.07.25
申请人 SECRON CO., LTD. 发明人 KIM, DU HWAN;CHOI, JIN JOO;CHOI, IL RAK
分类号 H01L21/56;H01L21/50;H01L21/60 主分类号 H01L21/56
代理机构 代理人
主权项
地址