发明名称 |
APPARATUS FOR PROVIDING EPOXY MOLDING COMPOUNDS |
摘要 |
PURPOSE: An apparatus for providing epoxy molding compounds is provided to simplify the structure of the apparatus by vibrating a guide unit for epoxy molding compound blocks by using a connection bar connected eccentrically to a motor. CONSTITUTION: An epoxy supply part(110) supplies epoxy molding compound blocks through a drop method. A guide unit(120) guides blocks which are under the epoxy supply part and drop the blocks to one side. A vibration part(130) shakes the guide unit so that the blocks are smoothly transferred. The vibration part comprises a motor which generates torque and a rotating member(134) that is connected to the motor and is rotated. A connection bar(136) interconnects the rotating member and the guide unit.
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申请公布号 |
KR20100011380(A) |
申请公布日期 |
2010.02.03 |
申请号 |
KR20080072573 |
申请日期 |
2008.07.25 |
申请人 |
SECRON CO., LTD. |
发明人 |
KIM, DU HWAN;CHOI, JIN JOO;CHOI, IL RAK |
分类号 |
H01L21/56;H01L21/50;H01L21/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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