Verfahren zur Herstellung von UEberzuegen aus Polyamid-imiden

摘要

1,171,242. Coated wire. GENERAL ELECTRIC CO. 6 April, 1967 [5 May, 1966], No. 15906/67. Heading B2K. [Also in Division C3] A composition comprising copper wire is coated with a solution in phenol and/or cresol of a polyamide acid and 0.05 to 0.5% by wt. of the polyamide acid, of a smoothness additive having the formula X-[D-O] a -[D1- O] b -D-X, wherein X is -(OH 2 ) e COOH, -(CH 2 ) e OH, -OH, -OSiR 3 111, -OSiR 2 111C 6 H 5 or -OSiR111(C 6 H 5 ) 2 ; D is -Si(R111) 2 -, or -Si(R111)(C 6 H 5 )-; D1 is -Si(R111)(C 6 H 5 )-, -Si(C 6 H 5 ) 2 - or -Si(R111)[(CH 2 ) e R1111]- phenyl radicals when present constituting less than 50% of the Si-bonded organic radicals in D and D1, R111 is an alkyl radical of 1 to 4 C atoms, R1111 is -CN or -COOR11111, R11111 is H, R111, -C 0 F 20 H or -CF 3 , a is an integer greater than 1 and preferably from 4 to over 100, b is 0 or 1 to less than 25, e is 1 to 4 and q is 1 to 11. The polyamide-amide acids used can be made by reacting a polyamide-diamine material with a dianhydride, as described in Specification 1,171,241, or by reacting in diamine with the monoacidchloride of trimelliticanhydride. In a typical Example (2) a cresol solution of the reaction product p-p1-diaminodiphenylmethane and azelaic acid was reacted with 3,314,41-benzophenonetetracarboxylic acid dianhydride in cresol to give a clear, viscous solution, to which a hydroxy terminated dimethylsiloxane-diphenylsiloxane copolymer was added, and the resulting composition was then coated on Cu wire and heat-cured to yield a polyamide-imide coating.