| 摘要 |
A heat dissipating structure of an integrated circuit chip of a plasma display module and a plasma display module including the same are disclosed. In one embodiment, the heat dissipating structure includes: a chassis including a chassis base and a chassis bending portion in which at least one protruding portion is formed and the integrated circuit chip which is mounted on the cassis bending portion and connected to a signal transmitting member. According to one embodiment of the present invention, since the protruding portion is formed in the chassis bending portion on which the integrated circuit chip is formed, the convective heat transfer efficiency is increased and the heat dissipating performance of the integrated circuit chip is improved.
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