发明名称 |
Power semiconductor device |
摘要 |
One of the aspects of the present invention is to provide a power semiconductor device, which includes at least one pair of power modules, each of which has a molding surface covered with molding resin and a radiating surface opposite to the molding surface. Also, the power semiconductor device includes a pair of radiating fins sandwiching the power modules such that the molding surfaces of the power modules contact each other and the radiating surfaces thereof each contact the radiating fins.
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申请公布号 |
US7656016(B2) |
申请公布日期 |
2010.02.02 |
申请号 |
US20050295442 |
申请日期 |
2005.12.07 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIMATSU NAOKI;YOSHIDA TAKANOBU;SHINOHARA TOSHIAKI |
分类号 |
H01L23/02;H01L23/36;H01L23/40;H01L25/07;H01L25/18;H02M7/48 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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