| 摘要 |
A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves assembling the semiconductor devices into a strip, isolating a portion of each of the semiconductor devices of the strip, and performing operations on the strip using a strip socket, wherein the strip socket is designed to make electrical contact substantially simultaneously with each semiconductor device in the strip.
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