发明名称 |
Reclaiming substrates having defects and contaminants |
摘要 |
Test substrates used to test semiconductor fabrication tools are reclaimed by reading from a database the process steps performed on each test substrate and selecting a reclamation process from a plurality of reclamation processes. The reclamation process can include crystal lattice defect or metallic contaminant reduction treatments for reclaiming each test substrate. Each test substrate is sorted and placed into a group of test substrates having a common defect or contaminant reduction treatment assigned to the test substrates of the group. Additional features are described and claimed.
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申请公布号 |
US7657390(B2) |
申请公布日期 |
2010.02.02 |
申请号 |
US20050265237 |
申请日期 |
2005.11.02 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
VEPA KRISHNA;BHATNAGAR YASHRAJ;RAYANDAYAN RONALD;WANG HONG |
分类号 |
G06F19/00 |
主分类号 |
G06F19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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