A BONDING STAGE OF WIRE BONDER CAPABLE OF IMPROVING A PRODUCTIVITY AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A bonding stage of a wire bonder capable of improving productivity and a manufacturing method of a semiconductor package using the same are provided to improve the efficiency of a production process by preventing unnecessary semiconductor chips from being attached to a matrix substrate. CONSTITUTION: A bottom body(310) for the bonding stage comprises at least a vacuum passages therein. A porous substrate(320) is installed on the bottom body of the bonding stage. A top of bonding state(330) is installed on the porous substrate and is combined with the bottom body of the bonding stage. A plurality of vacuum holes(332) adsorbing one semiconductor chip are installed in a matrix type. A wire bonder is used for the BOC(Board On Chip) package assembly. The porous substrate selects one of a ceramic particle and a metal particle.