发明名称 |
MULTILAYER PACKAGE AND A TRANSMITTER-RECEIVER MODULE PACKAGE OF ACTIVE PHASE ARRAY RADAR USING THE SAME |
摘要 |
PURPOSE: A multilayer package and a transmission/reception module package of a phase array radar using the same are provided to improve signal interference and reception sensitivity by mounting a transmission module and a reception module on different package substrates. CONSTITUTION: A printed circuit board(100) includes a plurality of circuit wiring patterns, a plurality of conductive pads, and at least one recess. A plurality of package substrates(102-104) are arranged in a recess of the printed circuit board and are electrically connected to the circuit wiring patterns. The plurality of package substrates are electrically connected through a conductive via. At least one circuit component is mounted on each package substrate. A heat sink(105) is connected to the lowermost package substrate among the plurality of package substrates. |
申请公布号 |
KR20100010276(A) |
申请公布日期 |
2010.02.01 |
申请号 |
KR20080071187 |
申请日期 |
2008.07.22 |
申请人 |
SAMSUNG THALES CO., LTD. |
发明人 |
CHUN, JONG HOON;KWON, YOUNG SE;YEO, SUNG KU |
分类号 |
H05K7/20;G01S13/00;H05K1/02;H05K3/46 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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