发明名称 MULTILAYER PACKAGE AND A TRANSMITTER-RECEIVER MODULE PACKAGE OF ACTIVE PHASE ARRAY RADAR USING THE SAME
摘要 PURPOSE: A multilayer package and a transmission/reception module package of a phase array radar using the same are provided to improve signal interference and reception sensitivity by mounting a transmission module and a reception module on different package substrates. CONSTITUTION: A printed circuit board(100) includes a plurality of circuit wiring patterns, a plurality of conductive pads, and at least one recess. A plurality of package substrates(102-104) are arranged in a recess of the printed circuit board and are electrically connected to the circuit wiring patterns. The plurality of package substrates are electrically connected through a conductive via. At least one circuit component is mounted on each package substrate. A heat sink(105) is connected to the lowermost package substrate among the plurality of package substrates.
申请公布号 KR20100010276(A) 申请公布日期 2010.02.01
申请号 KR20080071187 申请日期 2008.07.22
申请人 SAMSUNG THALES CO., LTD. 发明人 CHUN, JONG HOON;KWON, YOUNG SE;YEO, SUNG KU
分类号 H05K7/20;G01S13/00;H05K1/02;H05K3/46 主分类号 H05K7/20
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