| 摘要 |
<p>Semiaromatic semicrystalline thermoplastic polyamide molding compositions, comprising A) from 40 to 100% by weight of a copolyamide composed of a1) from 30 to 44 mol % of units which derive from terephthalic acid a2) from 6 to 20 mol % of units which derive from isophthalic acid a3) from 42 to 49.5 mol % of units which derive from hexamethylenediamine a4) from 0.5 to 8 mol % of units which derive from aromatic diamines having from 6 to 30 carbon atoms, where the molar percentages of components a1) to a4) together give 100%, and B) from 0 to 50% by weight of a fibrous or particulate filler C) from 0 to 30% by weight of an elastomeric polymer D) from 0 to 30% by weight of other additives and processing aids, where the percentages by weight of components A) to D) together give 100%.</p> |
