| 发明名称 |
METHOD AND APPARATUS FOR SOLDER BALL PLACEMENT |
| 摘要 |
<p>A solder ball mounting module comprising a solder ball template having an array of recesses, each recess being in communication with a vacuum source, and each arranged to receive a solder ball; wherein each recess further includes an ejector pin for selectively ejecting the respective solder ball engaged therein. Figure.1</p> |
| 申请公布号 |
SG157985(A1) |
申请公布日期 |
2010.01.29 |
| 申请号 |
SG20080049660 |
申请日期 |
2008.06.24 |
| 申请人 |
ROKKO VENTURES PTE LTD |
发明人 |
ANG, SOO LOO;LING, NEE SENG;YAU, KAM HUNG;PAI,LUKE |
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