SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A semiconductor device package and a manufacturing method thereof are provided to improve performance and reliability by reducing the contamination of the upper surface of a semiconductor due to the infiltration of molding materials. CONSTITUTION: A semiconductor chip(100) comprises an upper surface(104), a lower surface(102) faced to the upper surface, and a side surface(106). A conducting pad(120) electrically connected to an integrated circuit is positioned on the upper surface. A first insulating layer(122) is formed on the upper surface of the semiconductor chip. A filet member(200) covers the interface between the side of the semiconductor chip and the side of the first insulating layer. The filet member comprises a thermosetting material.