| 摘要 |
PURPOSE: A test wafer reproducing method for equipment performance check is provided to reduce production cost by reducing the whole consumption of a test wafer. CONSTITUTION: A first dilute hydrofluoric acid process is performed by processing a test wafer with the dilute hydrofluoric acid. A first dilute hydrofluoric acid cleaning process is performed by cleaning the test wafer processed with the dilute hydrofluoric acid. The second dilute hydrofluoric acid process is performed by processing the washed test wafer with the dilute hydrofluoric acid again. A second dilute hydrofluoric acid cleaning process is performed by cleaning the test wafer processed with dilute hydrofluoric acid. An ozone treatment process is performed by processing the washed test wafer with the ozone. An ozone cleaning process is performed by cleaning the processed test wafer. A drying process is performed by drying the test wafer.
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