SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to reduce stress on an MEMS chip by applying an ASIC chip on the MEMS chip through a chip. CONSTITUTION: MEMS chips(12) are integrated with a wafer. A cap(16) is attached to cover the upper side of each MEMS chip. The cap is attached except a bonding pad(14). The ASIC chip(20) is attached to the upper side of the cap. A wire(18) electrically connects the bonding pad of the ASIC chip and the MEMS chip. Molding compound resin(28) is molded throughout the whole upper surface of the ASIC chip, a part of the upper side of the cap, and the bonding pad site of the MEMS chip. The input-output terminal attaching hole is formed by removing the partial molding compound resin.