发明名称 Manufacturing method of a nonvolatile semiconductor memory device
摘要 A manufacturing method of a nonvolatile semiconductor memory device including: providing a first insulating film and a silicon film on a semiconductor substrate; providing a fifth insulating film containing silicon and oxygen on the silicon film; providing a second insulating film containing silicon and nitrogen on the fifth insulating film; providing a third insulating film on the second insulating film, the third insulating film is composed of a single-layer insulating film containing oxygen or multiple-layer stacked insulating film at least whose films on a top layer and a bottom layer contain oxygen, and relative dielectric constant of the single-layer insulating film and the stacked insulating film being larger than relative dielectric constant of a silicon oxide film; providing a fourth insulating film containing silicon and nitrogen on the third insulating film; and providing a control gate above the fourth insulating film.
申请公布号 US7651914(B2) 申请公布日期 2010.01.26
申请号 US20080176559 申请日期 2008.07.21
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 AKAHORI HIROSHI;TAKEUCHI WAKAKO;OZAWA YOSHIO
分类号 H01L21/336;H01L21/28;H01L21/3205 主分类号 H01L21/336
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