发明名称 Method for manufacturing semiconductor device
摘要 An object is to provide a method for manufacturing a semiconductor device, in which the number of photolithography steps can be reduced, the manufacturing process can be simplified, and manufacturing can be performed with high yield at low cost. A method for manufacturing a semiconductor device includes the following steps: forming a semiconductor film; irradiating a laser beam by passing the laser beam through a photomask including a shield for shielding the laser beam; subliming a region which has been irradiated with the laser beam through a region in which the shield is not formed in the photomask in the semiconductor film; forming an island-shaped semiconductor film in such a way that a region which is not irradiated with the laser beam is not sublimed because it is a region in which the shield is formed in the photomask; forming a first electrode which is one of a source electrode and a drain electrode and a second electrode which is the other one of the source electrode and the drain electrode; forming a gate insulating film; and forming a gate electrode over the gate insulating film.
申请公布号 US7651896(B2) 申请公布日期 2010.01.26
申请号 US20070844134 申请日期 2007.08.23
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 HONDA TATSUYA;ARAI YASUYUKI
分类号 H01L21/00 主分类号 H01L21/00
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