发明名称 Bandgap and recombination engineered emitter layers for SiGe HBT performance optimization
摘要 A method for fabricating a heterojunction bipolar transistor (HBT) is provided. The method includes providing a substrate including a collector region; forming a compound base region over the collector region; and forming an emitter region over the compound base region including forming a first emitter layer within the emitter region and doping the first emitter layer with a pre-determined percentage of at least one element associated with the compound base region. In one implementation, an emitter region is formed including multiple emitter layers to enhance a surface recombination surface area within the emitter region.
申请公布号 US7651919(B2) 申请公布日期 2010.01.26
申请号 US20050267553 申请日期 2005.11.04
申请人 ATMEL CORPORATION 发明人 ENICKS DARWIN GENE;CARVER DAMIAN
分类号 H01L21/331;H01L21/8222 主分类号 H01L21/331
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