| 摘要 |
A heat dissipating device includes a bracket, a heat dissipater and a circuit board. The bracket includes a bracket and a cover. The bracket includes an inside wall, an outside wall, a pair of sidewalls extending perpendicularly from opposite ends of the outside wall and opposite ends of the inside wall, and a bottom wall perpendicularly positioned between the sidewalls and connected to the inside wall. The cover is attached to the bracket. The heat dissipater is attached to the bottom wall and receiving in the cover. The circuit board is configured to supply power for the heat dissipater and attached to the bracket. The circuit board is capable of connecting with a power interface of the electrical device to power the heat dissipaters.
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