| 摘要 |
A contact lead for engaging with an aperture lead of a circuit carrier, including a substrate contact portion electrically connected to a pad on a substrate a chip contact portion extending from the substrate contact portion and forming an angle with the substrate contact portion raising from the substrate. The contact lead chip contact portion may also be of a cylindrical shape vertically extending from the substrate contact portion. The present invention also provides a module including a printed circuit board having a plurality of pad thereon ,the contact lead electrically connected to the pad, an integrated circuit carrier having a plurality of aperture leads, the aperture leads passing through the contact lead and contacting respectively thereof, and a housing structure for housing the module and providing access for the user to assemble the integrated circuit carrier.
|
