发明名称 |
Vapor augmented heatsink with multi-wick structure |
摘要 |
A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick structure and/or a spatially varying wick structure.
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申请公布号 |
US7650931(B2) |
申请公布日期 |
2010.01.26 |
申请号 |
US20080135297 |
申请日期 |
2008.06.09 |
申请人 |
COVERGENCE TECHNOLOGIES LIMITED |
发明人 |
SIU WING MING |
分类号 |
F28D15/04;F28D15/02;H01L23/427;H05K7/20 |
主分类号 |
F28D15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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