摘要 |
PURPOSE: A circuit board, a backlight unit using the same, and a manufacturing method thereof are provided to use the manufacturing method of a normal circuit board, thereby reducing remarkably the production cost. CONSTITUTION: A circuit board(100) comprises one or more LED(Light Emitting Diode) packages(130). A reflecting plate(200) is located on the circuit board. A through hole(210) is located in the upper side of the LED package. A brightness reinforcing unit(150) is located in the through hole on the circuit board. The brightness reinforcing unit at least has an area including the outermost of the through hole. The brightness reinforcing unit prevents from a green PSR(Photo Solder Resist)(120) from being exposed to the outside. The brightness reinforcing unit is formed with the coating of white ink. |