发明名称 POLISHING PAD DRESSING UNIT
摘要 PURPOSE: A polishing pad dressing unit is provided to prevent the degradation of the evenness of wafer in the wafer polishing. CONSTITUTION: The dressing unit for polishing pad(300) for the grinding pad includes a pair of tables, and a pair of grinding pads and carrier holder(40). A pair of grinding pads polishes the wafer. Wafer is supported in the carrier holder. The carrier for dresser(210) is combined in the carrier holder. Three dressers(220) has the each same outer shape. Three dressers is the circle shape. Three dressers perform the dressing of the grinding pad with the rubbing with the grinding pad.
申请公布号 KR20100008110(A) 申请公布日期 2010.01.25
申请号 KR20080068519 申请日期 2008.07.15
申请人 SILTRON INC. 发明人 YU, HWAN SU;JUNG, HEE HYUN;SONG, HYUN JIN
分类号 H01L21/304 主分类号 H01L21/304
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