| 发明名称 |
PLASTICS ETCHING COMPOSITION |
| 摘要 |
<p>The present invention provides a composition for the etching treatment of the non-conductive surface before chemical metallization. The etching composition contains (in mass percent): sulfuric acid 70-90, manganese salts 0,0001-0,01, water - residual amount. The concentration of the used sulfuric acid not less than 75 percent.@</p> |
| 申请公布号 |
LT2008055(A) |
申请公布日期 |
2010.01.25 |
| 申请号 |
LT20080000055 |
申请日期 |
2008.07.18 |
| 申请人 |
CHEMIJOS INSTITUTAS, , |
发明人 |
NARUSKEVICIUS, LEONAS,;BARANAUSKAS, MYKOLAS,;SIMKUNAITE, BIRUTE, |
| 分类号 |
C23C18/18;C23C18/20 |
主分类号 |
C23C18/18 |
| 代理机构 |
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代理人 |
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