发明名称 DIE EJECTING DEVICE FOR DIE BONDING DEVICE
摘要 PURPOSE: A die ejecting device for die bonding device is provided to perform easy replacement by insertion of the eject pin. CONSTITUTION: The pin holder(20) comprises the holder body(22), and the magnet plate(24) and working bar(21). The magnet plate is installed in the upper part of the holder body. The operating bar is installed in the lower part of the holder body. The eject dome(30) includes the dome body(32) and fixing unit(34). The tube-type through hole(33) is installed in the dome body portion. The eject pin(40) is inserted into the tube type penetration hole. The lower part of the eject pin is fixed to the magnet plate. According to the elevation of the pin holder, the eject pin ejects the die.
申请公布号 KR20100007350(A) 申请公布日期 2010.01.22
申请号 KR20080067953 申请日期 2008.07.14
申请人 SEMITECH CO., LTD. 发明人 LEE, WON WOO
分类号 H01L21/687 主分类号 H01L21/687
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